WebThe high-temperature hydrogenation of CF 4 in mixtures of CF 4 and H 2 is assumed to involve the reaction H + CF 4 → HF + CF 3.The hydrogen atoms here are either formed by the reaction of F and CF 3 (i.e., the products of the thermal dissociation of CF 4) with H 2, or by the thermal dissociation of H 2.In the former case, a complicated chain process is … Web電フロー型のケミカルドライエッチング装置を用いた これまでの研究により単独のCF4でもSiのエッチン グは可能であるが,Arを添加すればエッチング速度 *量子プロセス理工学専攻修士課程 **ハ子プロセス理工学専攻修士課程(現在株式会社 フジキン)
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WebApr 5, 2024 · As the flow rate of H 2 is increased, the concentration of SiF 4 was decreased, and which means that the etching of SiN x was suppressed while increasing HF concentration due to the reaction of... WebAn investigation of the etching characteristics and mechanism for both Si and SiO2 in CF4/C4F8/Ar inductively coupled plasmas under a constant gas pressure (4 mTorr), total … WebJun 4, 1998 · The effects of O 2 and N 2 addition on the etch rate and surface chemistry were established. Admixing O 2 to CF 4 increases the gas phase fluorine density and … togetherness tv show cancelled